THERMOSETTING DIE-BONDING FILM, DIE-BONDING FILM WITH DICING SHEET, AND PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE

摘要

The present invention provides a thermosetting die-bonding film with high heat conductivity, a die-bonding film with a dicing sheet using the same, and a method for manufacturing a semiconductor device. The present invention relates to the thermosetting die-bonding film which includes heat conductive particles. The surface of the heat conductive particles is processed by a silane coupling agent. The content of the heat conductive particles is 75 wt% of the thermosetting die-bonding film or more. The heat conductivity of the heat conductive particles after thermosetting is 1 W/m·K or more.