METHOD FOR CREATING A 3D STACKED MULTICHIP MODULE

摘要

A 3D stacked multichip module comprises a stack of W IC die. Each die has a patterned conductor layer, including an electrical contact region with electrical conductors and, in some examples, device circuitry over a substrate. The electrical conductors of the stacked die are aligned. Electrical connectors extend into the stack to contact landing pads on the electrical conductors to create a 3D stacked multichip module. The electrical connectors may pass through vertical vias in the electrical contact regions. The landing pads may be arranged in a stair stepped arrangement. The stacked multichip module may be made using a set of N etch masks with 2N−1being less than W and 2N being greater than or equal to W, with the etch masks alternatingly covering and exposing 2n−1 landing pads for each mask n=1, 2 . . . N.

主权项

1. A method for creating a three-dimensional stacked multichip module comprising:
providing a set of W integrated circuit die, W being an integer greater than 1, each die in the set comprising a patterned conductor layer, the patterned conductor layer comprising an electrical contact region, the electrical contact region comprising landing pads; mounting a handling die to a selected die in the set, over the patterned conductor layer; removing an exposed layer of the selected die to create an enhanced handling die; repeating the mounting and removing steps using the enhanced handling die in each iteration, and so that the landing pads on each die are aligned with those on the other die in the set, until all the die in the set are mounted, to create a three-dimensional stacked die; and forming connectors from a surface of the module though the three-dimensional stacked die to contacts in the aligned landing pads in each die in the set to create a three-dimensional stacked multichip module.