TOUCH SENSOR PANEL AND METHOD FOR MANUFACTURING THE SAME

摘要

A method for manufacturing a touch sensor panel with a reduced number of masks includes forming a first resist layer with both full and partial thickness patterns, the latter being at a region corresponding to a plurality of first sensor electrodes; etching a first transparent conductive layer and a first other conductive layer using the first resist layer patterns having both full and partial thicknesses; forming a second resist layer with both full and partial thickness patterns, the latter being at a region corresponding to a plurality of second sensor electrodes; and etching while using the second resist layer patterns.

主权项

1. A method for manufacturing a touch sensor panel which comprises a plurality of first interconnection electrodes connecting a plurality of first sensor electrodes in a first direction and a plurality of second interconnection electrodes connecting a plurality of second sensor electrodes in a different second direction, a first lead line connecting an interconnected plurality of first sensor electrodes to a first pad, and a second lead line connecting an interconnected plurality of second sensor electrodes to a second pad, the method comprising:
forming a first transparent conductive layer (TCL1) over a substrate, and forming a first other conductive layer (OCL1) over the first transparent conductive layer; forming a first resist layer pattern (PR1) of relatively full thickness at regions corresponding to the first lead line, the first pad, and the plurality of connection electrodes using a first mask, and forming the first resist layer pattern (PR1) to have less than its full thickness at a region corresponding to the plurality of first sensor electrodes; etching the first transparent conductive layer and the first other conductive layer using the first resist layer having the respective first full and partial thickness patterns; forming an insulating layer on the entire top surface of the substrate, forming a second transparent conductive layer (TCL2) over the insulating layer, and forming a second other conductive layer (OCL2) over the second transparent conductive layer; forming a second resist layer pattern (PR2) of relatively full thickness at regions corresponding to the plurality of interconnection electrodes, the second lead line, and the second pad using a second mask, and forming the second resist layer pattern (PR2) to have partial thickness less than its full thickness at a region corresponding to the plurality of second sensor electrodes; and etching the insulating layer, the second transparent conductive layer, and the second other conductive layer using the second resist layer having the respective second full and partial thickness patterns.