| 摘要 |
<p>The present invention relates to a semiconductor chip package and a manufacturing method thereof. According to the embodiment of the present invention, provided is the semiconductor chip package to reduce the total height thereof by corresponding to a height of a solder ball inserted into an opening part by inserting the solder ball of a circuit device into the opening part formed by passing through a part of a plurality of insulation layers and circuit layers and bonding the solder ball to a ball pad. Therefore, according to the present invention, the total height of the semiconductor chip package is reduced.</p> |
