LIGHT EMITTING DEVICE PACKAGE ARRAY

摘要

Disclosed is a light emitting device package array. The light emitting device package array of the present invention includes a light emitting device package which an LED chip is mounted on and has a hole formed in a lead part, and a PCB which has a fin corresponding to the hole. Because a light emitting device is not tilted in a soldering process, the light receiving efficiency from a light emitting device package to a light guide plate is improved, thereby reducing hot spots.