| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide an uncut portion removing device capable improving the production yield of wafers.SOLUTION: A first nozzle 30 injects a fluid to form a gap between an uncut portion 601 and a wafer row 60. A holding arm 710 rotates the uncut portion 601 to peel off a slice base 50 from an uncut portion 601 while increasing the gap between the uncut portion 601 and the wafer row 60. The uncut portion 601 is moved in a direction separating away from the uncut portion 601 to remove the same from the slice base 50. With this, interference between the wafer 600 and the uncut portion 601 is prevented when the wafer 600 is taken out. Thus, quality problem such as crack or chip of the wafer 600 is prevented; and further, the production yield of wafers can be improved.</p> |
