| 摘要 |
PROBLEM TO BE SOLVED: To provide a photosensitive resin composition capable of improving chemical resistance of a cured film, and to provide an electronic device.SOLUTION: The photosensitive resin composition comprises a polymer expressed by formula (1), a crosslinking agent that crosslinks with the polymer, a surfactant having a crosslinking group, and a photosensitizer. In formula (1), l and m represent molar content percentages in the polymer and satisfy l+m=1; n is 0, 1, or 2; R, R, Rand Reach independently represent hydrogen or an organic group having 1 to 30 carbon atoms; and A represents a maleic acid compound unit. |
