METHOD OF MANUFACTURING LIQUID EJECTING DEVICE

摘要

A liquid ejecting device is manufactured by bonding a wiring substrate to a liquid ejection head by means of an adhesive film. The liquid ejection head has a pressure chamber for ejecting liquid and an air chamber disposed adjacent to the pressure chamber with a wall of a piezoelectric body interposed therebetween. A pair of electrodes is provided, one on the wall surface of the pressure chamber and the other on the wall surface of the air chamber so as to sandwich the piezoelectric body wall. The wiring substrate has a connection terminal which is to be electrically connected at least to the electrode on the pressure chamber side at the time of bonding. The liquid ejection head has an opening for introducing liquid into the pressure chamber, while the wiring substrate has a through hole to be aligned with the opening at the time of bonding.

主权项

1. A method of manufacturing a liquid ejecting device equipped with a liquid ejection head comprising a pressure chamber communicating with an ejection port for ejecting liquid and having an opening for introducing liquid to be ejected from the ejection port and a plurality of air chambers separated from the pressure chamber, a piezoelectric body being arranged between the pressure chamber and at least one of the air chambers, a pair of electrodes being provided, one on the wall of the pressure chamber and the other on the wall of the at least one of the air chambers so as to sandwich the piezoelectric body, the liquid ejection head being so constructed as to eject liquid from the ejection port by applying a voltage between the pair of electrodes and causing the piezoelectric body to expand and contract, the method comprising:
bonding a wiring substrate having a connection terminal to be electrically connected to the electrode provided on the wall of the pressure chamber, wiring extending from the connection terminal and a through hole representing a cross-sectional area smaller than the cross-sectional area of the opening and formed at a position corresponding to the opening to a bonding surface of the liquid ejection head arranged at the side of the opening by means of an adhesive film; and electrically connecting the connection terminal of the wiring substrate and the electrode provided on the wall of the pressure chamber of the liquid ejection head.