COVER SURFACE FOR ELECTRONIC DEVICE AND TREATMENT METHOD THEREOF

摘要

A surface treating method for an electronic device case according to the present invention comprises: a process of processing a first pattern on one side of an upper mold and processing a second pattern on one side of a lower mold; a process of irradiating an UV molding liquid on the front of a material and the lower mold facing the rear of the material, respectively; a process of locating the material between the upper mold and the lower mold and compressing the same; a process of hardening the UV molding liquid; and a process of forming a print layer on the rear of the material by separating the material from the upper mold and the lower mold.