| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and a coating apparatus for covering a substrate in a common coating chamber by both an arc vapor deposition step and a sputtering step.SOLUTION: A vapor deposition apparatus 1 comprises: a process chamber 3 for setting and keeping a gas atmosphere; an entrance 4 and exit 5 for a process gas; anodes 6 and 61; and cylindrical deposition cathodes 2, 21 and 22 formed as targets and containing target materials 200, 201 and 202. Moreover, electric energy sources 7, 71 and 72 are provided to establish electric potentials between the anodes 6 and 61 and the cathodes 2, 21 and 22, so that the target materials 200, 201 and 202 of the cylindrical cathodes 2, 21 and 22 can be transferred into a vapor phase by an electric energy source, with magnetic field sources 8, 81 and 82 for generating magnetic fields being provided. In the process chamber 3, there are simultaneously disposed the cylindrical deposition cathodes 2 and 21 and the cylindrical arc cathodes 2 and 22. |
