| 摘要 |
<p>The present invention relates to a method for cutting a wafer for a stacked semiconductor package and, more particularly, to a method for cutting a wafer for a stacked semiconductor package, capable of fundamentally removing the delamination of a second adhesion member generated between a first bonding wire and the second adhesion member by forming a wire receiving groove on the lower side of a second semiconductor die and easily forming the wire receiving groove using blades with various shapes.</p> |
