发明名称 |
LIQUID COVERLAYS FOR FLEXIBLE PRINTED CIRCUIT BOARDS |
摘要 |
<p>The present invention relates to curable liquid coverlay compositions comprising polyamideimide resins for use in curable compositions for use as protective coverlay coatings for metal clad laminate materials in electronic components, such as flexible circuit boards. In particular, the invention relates to liquid coverlay compositions comprising polyamideimides having a terminal isocyanate group blocked by a thermally-dissociatable isocyanate-blocking group and the use of such compositions in preparation of flexible electronic components.</p> |
申请公布号 |
EP2408836(B1) |
申请公布日期 |
2014.12.10 |
申请号 |
EP20100710620 |
申请日期 |
2010.03.16 |
申请人 |
SUN CHEMICAL B.V. |
发明人 |
HALL, STEPHEN ANTHONY;DAVIS, RICHARD CHARLES;FORD, SIMON RICHARD;KLAUS, MATTHIAS;OGNIBENI, KARL-HEINZ |
分类号 |
C08G18/80;C08G18/34;C08G73/14;C08L63/00;C09D179/08;H01B3/30;H05K1/03;H05K3/28 |
主分类号 |
C08G18/80 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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