| 摘要 |
<p>A semiconductor device molding apparatus includes a top mold which includes a top cavity for molding semiconductor devices mounted on a substrate and a bottom mold which includes a bottom cavity on which the substrate is loaded. The top mold includes a pair of top cavity blocks which are arranged in parallel, a curl block which is arranged between the top cavity blocks, and a top chase block which mounts the curl block and the top cavity blocks. The curl block is inserted between the top cavity blocks by a slide method.</p> |
