| 摘要 |
<p>The present invention is to improve cleaning performance and secure miniaturization. A substrate processing apparatus according to an embodiment includes a first nozzle an a second nozzle which injects a processing liquid to a substrate, a moving unit which moves the first nozzle and the second nozzle, and a nozzle cleaning device which cleans at least a second nozzle. The nozzle cleaning device includes a cleaning bath and an overflow bath. The cleaning bath includes a storing part which stores a cleaning solution for cleaning at least the second nozzle and an overflow part which discharges a cleaning solution flowing over a predetermined water level from the storing part. The overflow bath is adjacent to the cleaning bath and discharges the cleaning solution discharged from the overflow to the outside.</p> |
