Adhesive tape cutting apparatus

摘要

The disclosure discloses an adhesive tape cutting apparatus. The apparatus includes a feeding roller configured to feed an adhesive tape, a guide plate configured to contact and guide a surface of the other side end of the adhesive tape, a movable blade configured to advance from the adhesive layer and cut the adhesive tape, disposed below the guide plate so that a blade edge of the movable plate vertically faces the guide plate, a travel mechanism for causing the movable blade to travel along the tape width direction along the guide plate, and a movable blade support device configured to support the movable blade with respect to the travel mechanism in the manner that the movable blade slopes so that the blade edge presses the adhesive tape to the guide plate in the travel direction along the tape width.

主权项

1. An adhesive tape cutting apparatus upon which an adhesive tape cartridge is mounted, the adhesive tape cartridge including: an adhesive tape roll winding an adhesive tape comprising a base layer, an adhesive layer for affixing said base layer to an adherend, and a separation material layer for covering said adhesive layer; a peeling part where said separation material layer is peeled from said adhesive tape that is fed from said adhesive tape roll and fed; a separation material roll winding said separation material layer peeled by said peeling part around a predetermined axis; the adhesive tape cutting apparatus with the adhesive tape cartridge comprising:
a feeding roller configured to feed said adhesive tape supplied from said adhesive tape cartridge mounted, in a tape posture in which a layer at a lower end is set as said separation material layer while a tape transverse cross-section is set substantially in a horizontal direction; and a cutting mechanism that is disposed on a downstream side from said peeling part along a tape feeding path and is configured to cut said adhesive tape after said separation material layer is peeled at said peeling part; said cutting mechanism comprising a guide plate provided along a tape width direction; a lower contact surface that is disposed at a lower portion of said guide plate and is configured to contact and guide an upper surface of of said adhesive tape after the peeling; a movable blade configured to cause an upper blade edge to advance across said adhesive layer and cut said adhesive tape after the peeling; said upper blade edge that is disposed in said movable blade below said guide plate so as to vertically face said lower contact surface and is configured to sandwich said adhesive tape after the peeling between itself and said guide plate below said guide plate along a vertical direction; a travel mechanism for causing said upper blade edge to travel along a tape width direction along said guide plate; and a movable blade support device configured to support said movable blade with respect to said travel mechanism in a manner such that the movable blade slopes so that said upper blade edge presses said adhesive tape after the peeling to said guide plate in said travel direction along said tape width.