Motherboard substrate having no memory interconnects

摘要

A computing device has a motherboard circuit substrate having at least one layer of electrical interconnects and a socket arranged to receive a main processor for the computing device, the socket electrically coupled to at least a portion of the layer of electrical interconnects, wherein the circuit substrate has no memory interconnects.

主权项

1. A computing device, comprising:
a motherboard circuit substrate having at least a first layer of electrical interconnects, the motherboard substrate having no memory connectors; a socket arranged to receive a main processor for the computing device, the socket electrically coupled to at least a portion of the first layer of electrical interconnects; an interposer substrate between the main processor and the socket such that the interposer substrate electrically connects to the main processor and the socket, wherein the interposer substrate has a first set of interconnects that electrically connect between the socket and the first layer of electrical interconnects; and at least one memory circuit on the interposer substrate, the memory circuit connected to the main processor through a second set of interconnects on the interposer substrate that connects to the main processor without connecting to the socket or the motherboard circuit substrate.