| 主权项 |
1. A semiconductor device, comprising:
a substrate having a first surface, a second surface opposite to the first surface, a first external connection terminal, at least two second external connection terminals, and a first wiring pattern, the first external connection terminal and the at least two second external connection terminals being disposed on the first surface, the first surface including a chip area in a middle portion of the first surface and a peripheral area surrounding the chip area, and the chip area and the peripheral area not overlapping with one another; and a semiconductor chip disposed on the chip area of the first surface, wherein: the first external connection terminal is formed in the peripheral area, the at least two second external connection terminals are formed in the peripheral area outside the first external connection terminal, the first wiring pattern extends from the first external connection terminal to an outer periphery of the first surface, the first wiring pattern passes through a place between adjacent ones of the at least two second external connection terminals, the semiconductor chip and the chip area sealed and the peripheral area is not sealed, a top surface of the first external connection terminal is exposed to air, and top surfaces of the at least two second external connection terminals are exposed to the air. |
