发明名称 Magnetic tunnel junction structure
摘要 Disclosed herein is a thermally-assisted magnetic tunnel junction structure including a thermal barrier. The thermal barrier is composed of a cermet material in a disordered form such that the thermal barrier has a low thermal conductivity and a high electric conductivity. Compared to conventional magnetic tunnel junction structures, the disclosed structure can be switched faster and has improved compatibility with standard semiconductor fabrication processes.
申请公布号 US8907390(B2) 申请公布日期 2014.12.09
申请号 US201012944663 申请日期 2010.11.11
申请人 Crocus Technology Inc. 发明人 Reid Jason
分类号 H01L29/76;H01L29/94;H01L31/062;H01L31/113;H01L31/119;H01F10/32;G11C11/16;B82Y25/00;H01L43/08 主分类号 H01L29/76
代理机构 Cooley LLP 代理人 Cooley LLP
主权项 1. A thermally-assisted magnetic tunnel junction structure, comprising: a magnetic tunnel junction; and a thermal barrier coupled to the magnetic tunnel junction, wherein the thermal barrier comprises a cermet material that comprises a ceramic component and a metallic component, the metallic component having a long range order that is no greater than 100 angstroms in the thermal barrier.
地址 Santa Clara CA US