发明名称 |
Magnetic tunnel junction structure |
摘要 |
Disclosed herein is a thermally-assisted magnetic tunnel junction structure including a thermal barrier. The thermal barrier is composed of a cermet material in a disordered form such that the thermal barrier has a low thermal conductivity and a high electric conductivity. Compared to conventional magnetic tunnel junction structures, the disclosed structure can be switched faster and has improved compatibility with standard semiconductor fabrication processes. |
申请公布号 |
US8907390(B2) |
申请公布日期 |
2014.12.09 |
申请号 |
US201012944663 |
申请日期 |
2010.11.11 |
申请人 |
Crocus Technology Inc. |
发明人 |
Reid Jason |
分类号 |
H01L29/76;H01L29/94;H01L31/062;H01L31/113;H01L31/119;H01F10/32;G11C11/16;B82Y25/00;H01L43/08 |
主分类号 |
H01L29/76 |
代理机构 |
Cooley LLP |
代理人 |
Cooley LLP |
主权项 |
1. A thermally-assisted magnetic tunnel junction structure, comprising:
a magnetic tunnel junction; and a thermal barrier coupled to the magnetic tunnel junction, wherein the thermal barrier comprises a cermet material that comprises a ceramic component and a metallic component, the metallic component having a long range order that is no greater than 100 angstroms in the thermal barrier. |
地址 |
Santa Clara CA US |