Electromagnetic shield for testing integrated circuits

摘要

An embodiment of a probe card is proposed. The probe card comprises a plurality of probes. Each probe is adapted to contact a corresponding terminal of a circuit integrated in at least one die of a semiconductor material wafer during a test phase of the wafer. Said plurality of probes includes at least one probe adapted to provide and/or receive a radio frequency test signal to/from the corresponding terminal during the test phase. Said probe card comprises at least one electromagnetic shield structure corresponding to the at least one probe adapted to provide and/or receive the radio frequency test signal for the at least partial shielding of an electromagnetic field irradiated by such at least one probe adapted to provide and/or receive the radio frequency test signal.

主权项

1. A wafer, comprising:
a first contact area configured to engage a probe tip; and a second contact area configured to engage an electromagnetic shield disposed in a scribe line area; and a third contact area coupled to the second contact area and disposed in the scribe line area separate from the second contact area.