发明名称 |
Method of packaging a die |
摘要 |
A method of attaching a die to a substrate is disclosed. A major surface of the die has an array of electrical contacts, and is covered with a tape segment having an array of apertures in register with the contacts. Solder balls are inserted into the apertures. The die is positioned against a substrate with the solder balls in register with the die pads on the surface of the substrate, and a heat treatment process is performed to bond the conductive elements to the corresponding bond pads. |
申请公布号 |
US8907501(B2) |
申请公布日期 |
2014.12.09 |
申请号 |
US201314030825 |
申请日期 |
2013.09.18 |
申请人 |
Infineon Technologies AG |
发明人 |
Lim Chee Chian |
分类号 |
H01L23/48;H01L23/00;H01L23/31;H01L23/498 |
主分类号 |
H01L23/48 |
代理机构 |
Slater & Matsil, L.L.P. |
代理人 |
Slater & Matsil, L.L.P. |
主权项 |
1. A system comprising:
a die comprising a plurality of electrical contacts; a substrate having a plurality of bond pads; a tape segment sandwiched between the die and the substrate, wherein the tape segment comprises a material layer, an adhesive layer and a plurality of apertures, wherein the adhesive layer of the tape segment is directly disposed on the die, and wherein the adhesive layer is different than the material layer; and a plurality of conductive elements disposed in the plurality of apertures, each conductive element being respectively bonded to a corresponding one of the plurality of electrical contacts and the plurality of bond pads. |
地址 |
Neubiberg DE |