Multi-die wirebond packages with elongated windows

摘要

A microelectronic package can include a substrate having first and second opposed surfaces extending in first and second transverse directions and an opening extending between the first and second surfaces and defining first and second distinct parts each elongated along a common axis extending in the first direction, first and second microelectronic elements each having a front surface facing the first surface of the substrate and a column of contacts at the respective front surface, a plurality of terminals exposed at the second surface, and first and second electrical connections aligned with the respective first and second parts of the opening and extending from at least some of the contacts of the respective first and second microelectronic elements to at least some of the terminals. The column of contacts of the first and second microelectronic elements can be aligned with the respective first and second parts of the opening.

主权项

1. A microelectronic package, comprising:
a substrate having first and second opposed surfaces, each extending in a first direction and a second direction transverse to the first direction, the substrate having a first opening extending between the first and second surfaces and defining first and second distinct parts each elongated along a first common axis extending in the first direction; first and second microelectronic elements each having a front surface facing the first surface of the substrate and a column of contacts at the respective front surface, the column of contacts of the first microelectronic element aligned with the first part of the first opening, the column of contacts of the second microelectronic element aligned with the second part of the first opening; a plurality of terminals exposed at the second surface, the terminals configured for connecting the microelectronic package to at least one component external to the microelectronic package; first electrical connections aligned with the first part of the first opening extending from at least some of the contacts of the first microelectronic element to at least some of the terminals; and second electrical connections aligned with the second part of the first opening extending from at least some of the contacts of the second microelectronic element to at least some of the terminals, wherein the first and second microelectronic elements each have a rear surface opposite the respective front surface, and wherein the first and second microelectronic elements each have: first and second opposed edges extending between the front and rear surface of the respective microelectronic element and extending in the first direction; and a first outer region adjacent the first edge, a second outer region adjacent the second edge, and a central region disposed between the first and second outer regions, each of the first and second outer regions and the central region having equal width such that the central region extends a middle third of a distance between the first and second edges, wherein the contacts of the respective microelectronic element are disposed in the respective central region.