发明名称 Electrophoretic display device and manufacturing method thereof
摘要 Disclosed is an electrophoretic display device and manufacturing method thereof, which prevent water from penetrating into an electrophoretic film. The electrophoretic display device comprises an electrophoretic display panel comprising a substrate with a thin film transistor formed thereon, and an electrophoretic film coupled to the substrate; a protective sheet coupled to the electrophoretic film; a circuit film coupled to the substrate to be disposed at an outer side of the electrophoretic film; a first sealant formed on the substrate, for sealing a gap between the electrophoretic film and the protective sheet and a gap between the electrophoretic film and the substrate; and a second sealant sealing a gap between the substrate and the circuit film.
申请公布号 US8908257(B2) 申请公布日期 2014.12.09
申请号 US201113243589 申请日期 2011.09.23
申请人 LG Display Co., Ltd. 发明人 Song SangMoo;Jung DaeSung;Shin YoungJoon
分类号 G02B26/00;G02B26/08;G02F1/29;G02F1/03;G02F1/07 主分类号 G02B26/00
代理机构 Brinks Gilson & Lione 代理人 Brinks Gilson & Lione
主权项 1. An electrophoretic display (EPD) device comprising: an electrophoretic display panel comprising a substrate with a thin film transistor formed thereon, and an electrophoretic film coupled to the substrate; a protective sheet coupled to the electrophoretic film; a circuit film coupled to the substrate to be disposed at an outer side of the electrophoretic film; a first sealant formed on the substrate to surround the entire outer side of the electrophoretic film, for sealing a gap between the electrophoretic film and the protective sheet and a gap between the electrophoretic film and the substrate; a support member coupled to the substrate to be disposed on the reverse of the electrophoretic film with respect to the substrate; and a second sealant formed between the circuit film and the support member, for sealing a gap between the substrate and the circuit film, wherein the first sealant is formed at the one surface of the circuit film, wherein the second sealant is formed at another surface of the circuit film on the reverse of one surface of the circuit film and is in contact with the support member, wherein the support member is coupled to the substrate to protrude outward from the substrate and support the second sealant at a portion of the support member protruding from the substrate.
地址 Seoul KR