| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a flexible printed wiring board, by which an insulating film for a flexible printed wiring board excellent in reliability in shock resistance, flexibility and warpage resistance as well as in process accuracy can be collectively formed with good workability.SOLUTION: The method for manufacturing a flexible printed wiring board includes steps of: forming at least one layer of a resin layer (A) comprising an alkali development type photosensitive resin composition (A1) on a flexible printed wiring board; forming at least one layer of a resin layer (B) comprising a photosensitive thermosetting resin composition (B1) containing an alkali-soluble resin having an imide ring, a photo-base generator and a heat-reactive compound on the resin layer (A); irradiating the resin layers (A) and (B) formed in the above-described steps with light along a pattern; heating the resin layers (A) and (B) irradiated with light in the above-described step; and forming a coverlay or the like by subjecting the resin layers (A) and (B) irradiated with light to alkali development. |
