WAFER CHAMFER DEVICE AND WAFER CHAMFER METHOD

摘要

PROBLEM TO BE SOLVED: To significantly shorten the processing time required for chamfering an outer peripheral surface of a wafer.SOLUTION: A wafer chamfer device of the invention includes: a wafer table which holds and rotates a wafer W; a rough grinding grind stone 158 which is formed so as to move relative to the wafer W and roughly grinds an outer peripheral part of the wafer W; and a precision grinding grind stone 164 which is formed so as to move relative to the wafer W and precisely grinds the outer peripheral part of the wafer W at a position different from the rough grinding grind stone 158. The structure allows the wafer chamfer device to simultaneously conduct rough grinding (rough processing) and precision grinding (finish processing) at positions of the outer peripheral part of the wafer W which are different from each other.