| 摘要 |
PROBLEM TO BE SOLVED: To provide a discharge auxiliary type laser hole machining device which prevents machining chips from attaching to a laser optical system during through hole forming processing.SOLUTION: A discharge auxiliary type laser hole machining device forms a plurality of through holes on an insulating substrate by laser beam irradiation, and adjusts a shape of the through hole by a discharge phenomenon between first and second electrodes. The device includes a laser light source which radiates a laser beam, a laser optical system which irradiates a through hole forming position on the insulating substrate with the laser beam as an irradiation laser beam, and the first and second electrodes which generate discharge. The laser optical system includes a protection cover on an outlet side of the irradiation laser beam. The discharge auxiliary type laser hole machining device includes air flow generating means which generates an air flow on an emission side of the irradiation laser beam of the protection cover, and sucking means which sucks machining chips generated from the insulating substrate. |
