| 摘要 |
The present invention relates to technique and constitution about laminated interconnection structure for a bridge interconnection unit of an integrated circuit assembly. According to an embodiment, an apparatus includes a substrate and a bridge embedded inside the substrate. The bridge routes an electric signal between two dies. An interconnection structure electrically connected to the bridge includes a via structure including first conductive material, a barrier layer including second conductive material arranged on the via, and soldering material including third conductive material arranged on the barrier layer. The first, second, and third conductive materials are able to have respectively different chemical composition. Various other embodiments may be described or claimed. |
