| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate for mounting an electronic component in which an electric signal from a mounted electronic component is less likely to spread to the outside world, even if it is made compact, and interference or coupling of the electric signals can be suppressed between adjacent electronic components, and to provide an electronic component mounting package using the same.SOLUTION: A substrate for mounting an electronic component includes: a base substrate 3 composed of a ceramic sintered compact, and having a mounting region 1 for mounting an electronic component 10; a frame body 5 composed of a ceramic sintered compact, and arranged to surround the mounting region 1 on the base substrate 3; and a mesh-like conductor layer 11 provided on the frame body 5. |
