| 摘要 |
PROBLEM TO BE SOLVED: To provide an electrode having a resistance to a current flowing through a joint, even if miniaturizing the electrode, and less likely to cause defective bonding due to variation in the height of the electrode, and to provide an electronic component, an electronic device and a bonding method of an electrode.SOLUTION: An electrode includes a bonding surface to which the tip of an opponent electrode is welded via a solder when being heat treated under first conditions, and a bank arranged in a region surrounding at least a portion, where the tip of the opponent electrode is bonded, out of the bonding surface, and where the solder spreads when being heat treated under second conditions different from the first conditions. |
