发明名称 PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD
摘要 PROBLEM TO BE SOLVED: To provide a printed circuit board and a method of manufacturing the printed circuit board which are capable of implementing both a fine circuit pattern and reliable power signal transmission.SOLUTION: A printed circuit board 100 of the present invention includes a base substrate 110; a through via 153 formed to penetrate through the base substrate 110; and circuit patterns 151, 152 formed on one side and the other side of the base substrate 110 and formed to be thinner than an inner wall of the through via 153.
申请公布号 JP2014229895(A) 申请公布日期 2014.12.08
申请号 JP20140009303 申请日期 2014.01.22
申请人 SAMSUNG ELECTRO-MECHANICS CO LTD 发明人 PARK SUN WOOK;KWEON YOUNG DO;KIM JIN GU
分类号 H05K3/24;H05K3/18 主分类号 H05K3/24
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