| 摘要 |
PROBLEM TO BE SOLVED: To provide a power conversion device which improves vibration resistance and is capable of suppressing expansion of a semiconductor module and improving assemblability during manufacturing.SOLUTION: A power conversion device 1 comprises a laminate 10, a case 4, a pressurizing member 11 and a pair of fixed members 5a and 5b. The laminate 10 is formed by laminating a semiconductor module 2 and a cooling pipe 3. The case 4 includes a support plate 40 and a sidewall 41. While using the pressurizing member 11, the laminate 10 is pressurized in a direction of lamination and fixed to the case 4. A pair of protrusions 22 protrude from a main body part 20 of the semiconductor module 1 in the direction of lamination. The protrusions 22 are engaged to the cooling pipe 3. The cooling pipe 3 is held in a thickness direction between the protrusions 22 and the support plate 40. The cooling pipe 3 is held in a width direction between the pair of fixed members 5a and 5b. |
