| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a printed wiring board excellent in insulation reliability between interconnections.SOLUTION: A printed wiring board 100 comprises an insulation layer 103 having a via hole 101 and a circuit layer 105 provided at least on one surface 110 of the insulation layer 103. In the printed wiring board 100, an average of a ratio of a chrome content to a carbon content at a peripheral region C1 of the via hole 101 on the one surface 110 of the insulation layer 103, which are measured by X-ray photoemission spectroscopy is not higher than 0.090, and ten point mean roughness Rz of the one surface 110 of the insulation layer 103, which is measured in conformity to JIS B0601:2001 is not lower than 1.2μm.</p> |
