| 摘要 |
<p>An epoxy resin composition according to an embodiment of the present invention includes an epoxy compound including a mesogen structure and having the following structure, a curing agent, an inorganic filler and an additive for increasing adhesiveness with a metal. The curing agent includes diaminodiphenyl sulfone, and R^1 to R^14 may be independently selected from the group consisting of H, Cl, Br, F, C_1-C_3 alkyl, C_2-C_3 alkene, C_2-C_3 alkyne, and m and n are independently 1, 2 or 3.</p> |
