WIRING BOARD AND MANUFACTURING METHOD OF THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a wiring board and the like which can inhibit warpage while achieving high density of a wiring layer.SOLUTION: The present wiring board comprises: a first wiring member provided with an insulation layer and a wiring layer which consist primarily of a thermosetting resin; a second wiring member which is laminated on one side of the first wiring member and provided with an insulation layer and a wiring layer which consist primarily of a photosensitive resin; and an outermost insulation layer which is laminated on the other side of the first wiring member and consists primarily of a photosensitive resin. The wiring density of the second wiring member is higher than the wiring density of the first wiring member and a ratio of the thickness of the second wiring member to the thickness of the outermost insulation layer is equal to or smaller than 1.