| 摘要 |
PROBLEM TO BE SOLVED: To provide a cutting device capable of removing a surplus connection part when cutting a package substrate in a jig-type holding table.SOLUTION: A cutting device comprises at least a holding table 4 which sucks and holds a package substrate 5 formed of a device part 51 and a surplus connection part 52 and cutting means including a cutting blade for cutting the package substrate sucked and held in the holding table and a cutting water supply nozzle. The holding table comprises: a clearance groove 41 formed in the position corresponding to division schedule lines 56A and 56B of the package substrate; a plurality of suction holes 42 for sucking and holding a plurality of package devices formed in the area partitioned by the clearance groove; a suction source communicating with the suction holes; a plurality of air nozzles 43 formed in the position corresponding to the surplus connection part; and a compressed air supply source communicating with the air nozzles. |
