| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a circuit wiring line by laser etching which enables the formation of a high-density electrode circuit wiring line of no more than 50/50 μm in L/S hard to treat by conventional screen printing, and enables the manufacturing thereof with a low environmental load at low cost.SOLUTION: A method of manufacturing a circuit wiring line comprises the steps of: forming a coating film on a base material by use of a conductive paste including a binder resin(A) consisting of a thermoplastic resin, metal powder (B), and an organic solvent (C); subsequently, drying the coating film; and thereafter, forming a circuit wiring line of no more than 50/50 μm in L/S by laser etching. |
