SEMICONDUCTOR WAFER, PROBE CARD, SEMICONDUCTOR WAFER TESTING DEVICE, AND SEMICONDUCTOR WAFER TESTING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a wafer that enables testing of a plurality of IC chips in wafer test, and to provide a probe card that enables testing of the plurality of IC chips and that is easily manufactured and repaired.SOLUTION: In a semiconductor wafer (130), a plurality of IC chips (132) are formed. Pads are arranged so that a center position of a pad (133a) of one IC chip (132a) of a pair of adjacent IC chips, and a center position of a pad (133b) of the other IC chip (132b) of the pair of adjacent IC chips are not overlapped with each other in a direction along a boundary line between the pair of IC chips.