| 摘要 |
A sputtering device is provided with: a vacuum vessel; a substrate holder that can dispose a substrate in a prescribed position within the vacuum vessel; a target support body that can dispose a target so as to face the substrate disposed by the substrate holder; a cathode magnet disposed on the opposite side of the target support body from the substrate; a magnet moving unit that adjusts the distance between the cathode magnet and the target support body; a target moving unit that adjusts the distance between the target support body and the substrate; and a control unit that controls the target moving unit and the magnet moving unit. |
