发明名称 PROCESS FOR BONDING INTERSTITIAL EPOXY ADHESIVE FOR FABRICATION OF PRINTHEAD STRUCTURES IN HIGH DENSITY PRINTHEADS
摘要 <p>PROBLEM TO BE SOLVED: To provide a bonding method for forming an ink jet printhead which provides a good bond strength and little squeezing-out to prevent blocking of a liquid path, is sufficiently resistant to oxidation at elevated temperatures during use, and inhibits increase in weight and swell of adhesives due to inks at elevated temperatures.SOLUTION: A method comprises: after tacking an epoxy adhesive to a first substrate and a second substrate, partially curing the epoxy adhesive by heating the first substrate, the second substrate and the epoxy adhesive to a temperature between about 80°C and about 140°C for a duration of about 10 minutes to about 20 minutes; and, after partially curing the epoxy adhesive, and fully curing the epoxy adhesive by heating the first substrate, the second substrate and the epoxy adhesive within a press to a temperature between 100°C and 300°C for a duration of about 20 minutes to about 200 minutes and at a pressure of 40 psi to 100 psi.</p>
申请公布号 JP2014223802(A) 申请公布日期 2014.12.04
申请号 JP20140094533 申请日期 2014.05.01
申请人 XEROX CORP 发明人 MANDAKINI KANUNGO ; ZHAO HONG ; ZUO YANJIA ; BADESHA SANTOKH S
分类号 B41J2/16;B41J2/14;C08G59/32;C08G59/40;C09J5/06;C09J11/06;C09J163/00 主分类号 B41J2/16
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