PHOTOSENSITIVE ADHESIVE COMPOSITION, AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide: a photosensitive adhesive composition which makes possible to glue semiconductor elements to each other while relaxing the concentration of stress; and a semiconductor device which includes a lamination type semiconductor element arranged by gluing semiconductor elements to each other with such a photosensitive adhesive composition and which is highly reliable and easy to manufacture.SOLUTION: A photosensitive adhesive composition is used between layers of a lamination type semiconductor element. The hardened material of the photosensitive adhesive composition has an elastic modulus of 2.0-3.5 GPa at 25°C. The elastic modulus which the photosensitive adhesive composition has at 25°C before being hardened is 70-120% of the elastic modulus of the hardened material at 25°C. The adhesive force which the composition before being hardened after having gone through an etching process and an ashing process exhibits to a semiconductor element at 25°C is 20-200 N. The minimum melt viscosity which the composition before being hardened has in a range of 100-200°C is 20-500 Pa s. In addition, a semiconductor device 10 comprises: semiconductor chips 20; and adhesion layers 601 each including the hardened material of the photosensitive adhesive composition of the invention.