SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

摘要

A technique capable of enhancing a reliability of a semiconductor device is provided. A semiconductor device has a die pad on which a semiconductor chip is mounted. The die pad is sealed with resin so that a lower surface located on an opposite side of an upper surface on which the semiconductor chip is mounted is exposed. Also, the die pad has a central part including a region in which the semiconductor chip is mounted and a peripheral edge part provided next to the central part in a planar view. In addition, a step surface formed so that a height of the peripheral edge part becomes higher than a height of the central part is provided at a boundary between the central part and the peripheral edge part.

主权项

1. A semiconductor device, comprising:
die pad which has a first surface, a second surface located on an opposite side of the first surface, and a side of the first surface; a plurality of leads arranged along the side of the first surface; a semiconductor chip which has a front surface, a plurality of electrodes formed on the front surface, and a rear surface located on an opposite side of the front surface, and is mounted on a chip mounting region of the first surface of the die pad; a plurality of first wires which electrically connect some of the plurality of electrodes of the semiconductor chip and the plurality of leads; second wires which electrically connect the others of the plurality of electrodes of the semiconductor chip and the die pad; and a sealing body which seals the semiconductor chip, the plurality of first wires and the second wires so that a part of the plurality of leads and the second surface of the die pad are exposed, wherein the die pad includes: a first portion which has a third surface including the chip mounting region and facing the same direction as the first surface and a fourth surface located on an opposite side of the third surface; a second portion which has a fifth surface facing the same direction as the first surface and a sixth surface located on an opposite side of the fifth surface and is provided so as to surround the first portion in a planar view; and a first step surface which is provided on the first surface between the third surface of the first portion and the fifth surface of the second portion, the second wire is connected to a wire connection region provided on the fifth surface of the second portion, and the fifth surface of the second portion is arranged at a position higher than the third surface of the first portion.