| 发明名称 |
FORMATION OF DIELECTRIC WITH SMOOTH SURFACE |
| 摘要 |
Embodiments of the present disclosure are directed towards techniques and configurations for formation of a dielectric with a smooth surface. In one embodiment, a method includes providing a dielectric with first and second surfaces, a conductive feature formed on the first surface, and a laminate applied to the second surface, curing the second surface while the laminate remains applied, and removing the laminate. Other embodiments may be described and/or claimed. |
| 申请公布号 |
US2014353019(A1) |
申请公布日期 |
2014.12.04 |
| 申请号 |
US201313906229 |
申请日期 |
2013.05.30 |
| 申请人 |
Arora Deepak;Sobieski Daniel N.;Seneviratne Dilan;Andideh Ebrahim;Meyer James C. |
发明人 |
Arora Deepak;Sobieski Daniel N.;Seneviratne Dilan;Andideh Ebrahim;Meyer James C. |
| 分类号 |
C23C14/22;H05K1/11;H01L21/02;H05K1/03;C23C14/34;C23C14/14 |
主分类号 |
C23C14/22 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method, comprising:
providing a dielectric with first and second surfaces, a conductive feature formed on the first surface, and a laminate applied to the second surface; curing the second surface while the laminate remains applied; and removing the laminate. |
| 地址 |
Chandler AZ US |
