发明名称 SILVER PASTE COMPOSITION
摘要 <p>PROBLEM TO BE SOLVED: To provide a silver paste composition which can be sintered at a low temperature and provides a silver sintered body having excellent bonding strength and heat conductivity after adhesion.SOLUTION: Provided is a silver paste composition comprising silver particles and a solvent, or silver particles, a solvent, and an additive, where at least one of the silver particles has a lattice strainη, determined by the formula (1) of a Williamson-Hall method, becomes 5.5×10or more:βcosθ=λ/D+2ηsinθ(1), where,βis the diffraction line width [rad];θis the diffraction angle [°];λis the wavelength of X ray (CuKαray)[1.54Å]; D is the crystallite diameter [Å]; andηis the lattice strain.</p>
申请公布号 JP2014225350(A) 申请公布日期 2014.12.04
申请号 JP20130103226 申请日期 2013.05.15
申请人 HITACHI CHEMICAL CO LTD 发明人 ISHIKAWA MASARU;MATSUMOTO HIROSHI;NATORI MICHIKO;NAKAKO TAKEO;TANAKA TOSHIAKI
分类号 H01B1/22;B22F1/00;B22F9/00;C09J1/00;C09J9/02;H01B1/00;H01L21/52 主分类号 H01B1/22
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