| 发明名称 |
SEMICONDUCTOR WAFER PROTECTION FILM AND PRODUCTION METHOD FOR SEMICONDUCTOR DEVICE |
| 摘要 |
In the present invention, a semiconductor wafer protection film has a base material layer (A) and an adhesive layer (C) formed on the base material layer (A). The base material layer (A) includes a polymer, and the solubility parameter of the polymer as found by the Van Krevelen method is nine or greater. |
| 申请公布号 |
WO2014192630(A1) |
申请公布日期 |
2014.12.04 |
| 申请号 |
WO2014JP63577 |
申请日期 |
2014.05.22 |
| 申请人 |
MITSUI CHEMICALS TOHCELLO, INC. |
发明人 |
MORIMOTO AKIMITSU;KATAOKA MAKOTO;FUKUMOTO HIDEKI |
| 分类号 |
H01L21/304;B32B27/30;C09J7/02;C09J133/00;H01L21/301 |
主分类号 |
H01L21/304 |
| 代理机构 |
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