发明名称 PHOTOCURABLE CONDUCTIVE MATERIAL, METHOD OF PRODUCING CONNECTION STRUCTURE AND CONNECTION STRUCTURE
摘要 <p>PROBLEM TO BE SOLVED: To provide a photocurable conductive material which improves connection reliability of the to-be-connected members and conduction reliability between the electrodes when connecting electrodes of to-be-connected members.SOLUTION: A photocurable conductive material is used in electric connection between electrodes 2a and 3a and has photo-hardenability. The photocurable conductive material includes a conductive particle 22, a light reflection particle 23 composed of a material of a refractive index of 1.6 or greater and a binder resin 11 having photo-hardenability.</p>
申请公布号 JP2014225441(A) 申请公布日期 2014.12.04
申请号 JP20140084549 申请日期 2014.04.16
申请人 SEKISUI CHEM CO LTD 发明人 UENOYAMA SHINYA;MAHARA SHIGEO
分类号 H01B1/22;H01B1/00;H01R11/01;H01R43/00 主分类号 H01B1/22
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