发明名称 |
PHOTOCURABLE CONDUCTIVE MATERIAL, METHOD OF PRODUCING CONNECTION STRUCTURE AND CONNECTION STRUCTURE |
摘要 |
<p>PROBLEM TO BE SOLVED: To provide a photocurable conductive material which improves connection reliability of the to-be-connected members and conduction reliability between the electrodes when connecting electrodes of to-be-connected members.SOLUTION: A photocurable conductive material is used in electric connection between electrodes 2a and 3a and has photo-hardenability. The photocurable conductive material includes a conductive particle 22, a light reflection particle 23 composed of a material of a refractive index of 1.6 or greater and a binder resin 11 having photo-hardenability.</p> |
申请公布号 |
JP2014225441(A) |
申请公布日期 |
2014.12.04 |
申请号 |
JP20140084549 |
申请日期 |
2014.04.16 |
申请人 |
SEKISUI CHEM CO LTD |
发明人 |
UENOYAMA SHINYA;MAHARA SHIGEO |
分类号 |
H01B1/22;H01B1/00;H01R11/01;H01R43/00 |
主分类号 |
H01B1/22 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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