| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide an etchant and a replenishment liquid thereof which can suppress side etching without interfering with linearity of copper wiring; and to provide a method for forming copper wiring.SOLUTION: Provided is an etchant for copper, which is an aqueous solution comprising: an aliphatic heterocyclic compound including a 5 to 7-membered aliphatic heterocyclic ring having only nitrogen as heteroatoms composing the ring; an acid; and an oxidizing metal ion. The aliphatic heterocyclic compound is at least one selected from an aliphatic heterocyclic compound A containing two or more nitrogen atoms as the heteroatoms, and an aliphatic heterocyclic compound B substituted by a substituent having an amino group. The method for forming copper wiring (1) comprises etching a portion of a copper layer which is not coated with an etching resist (2), where the etching is performed by using the etchant.</p> |
