发明名称 集積化センサの配列
摘要 <p>An integrated circuit comprises a lead frame, a base substrate and first and second substrates coupled to the base substrate. The first substrate has an electronic component disposed on its surface, and the second substrate has a magnetic field sensing element disposed on its surface, and first and second substrates can be arranged in a variety of configurations.</p>
申请公布号 JP5635966(B2) 申请公布日期 2014.12.03
申请号 JP20110264267 申请日期 2011.12.02
申请人 发明人
分类号 G01R15/20;G01R33/07;H01L43/02;H01L43/04 主分类号 G01R15/20
代理机构 代理人
主权项
地址