| 摘要 |
PROBLEM TO BE SOLVED: To provide a technology capable of improving reliability of a semiconductor package.SOLUTION: The method for manufacturing the semiconductor package includes the steps of: forming a wire 2 (wiring layer) having an electrode pad 2a on a build-up resin layer 1 (build-up substrate); subjecting the surface of the wire 2 to a roughening treatment; forming an inorganic insulating film 5 on the build-up resin layer 1 so as to cover the wire 2, forming a resist film 9 on the build-up resin layer 1 so as to cover the inorganic insulating film 5, and then removing the resist film 9 on the electrode pad 2a; removing the inorganic insulating film 5 on the electrode pad 2a by using the resist film 9 as a mask to expose the electrode pad 2a; and removing the remaining resist film 9 to form a solder resist layer for exposing the electrode pad 2a on the build-up resin layer 1 so as to cover the inorganic insulating film 5. |
