半導体モジュール,申请号JP20130176259-传众专利搜索

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发明名称	半導体モジュール
摘要
申请公布号	JP5633612(B2)	申请公布日期	2014.12.03
申请号	JP20130176259	申请日期	2013.08.28
申请人		发明人
分类号	H01L23/34;H01L25/07;H01L25/18	主分类号	H01L23/34
代理机构		代理人
主权项
地址

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