| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermosetting resin composition from which a cured product excellent in dimensional stability and an insulating layer excellent also in low-temperature meltability are obtained and which exhibits excellent stability, and an interlayer adhesive film for obtaining an insulating layer. SOLUTION: The thermosetting resin composition contains a polyimide resin (A) having a biphenyl skeleton directly linked to a 5-membered cyclic imide skeleton and having a content of the bisphenyl skeleton of 20-45 mass%, a logarithmic viscosity of 0.2-0.8 dl/g, and an acid value of 10-100, an epoxy resin (B), and an inorganic filler (C) having a specific surface area of 20-200 m<SP POS="POST">2</SP>/g. The interlayer adhesive film for a printed wiring board is obtained by applying the thermosetting resin composition onto a carrier film and drying it. COPYRIGHT: (C)2012,JPO&INPIT |
