Semiconductor package including multiple chips and separate groups of leads

摘要

Provided is a semiconductor package including multiple semiconductor chips, and separate groups of leads connected to the semiconductor chips. The leads are exposed to the outside of the semiconductor package. The plurality of leads may include a first lead group for a first chip group and a second lead group for a second chip group. The first and second chip groups are part of the package.

主权项

1. A semiconductor package comprising:
a packaging substrate including a plurality of terminals on the packaging substrate, the plurality of terminals including,
a first group of terminals configured to receive respective channel lines of a first channel from a controller, wherein the first group of terminals includes a chip enable terminal configured to receive a chip enable channel line of the first channel from the controller, anda second group of terminals configured to receive respective channel lines of a second channel from the controller; a first semiconductor chip group on the packaging substrate, wherein the first semiconductor chip group includes a first plurality of semiconductor chips electrically connected to terminals of the first group of terminals; a second semiconductor chip group on the packaging substrate, wherein the second semiconductor chip group includes a second plurality of semiconductor chips electrically connected to terminals of the second group of terminals; and a chip enable signal line providing electrical connection between the chip enable terminal and first and second semiconductor chips of the first plurality of semiconductor chips.